Robert Simons Editor-in-Chief, Winter 2010 Issue Resolutions As you read this editorial we are fast approaching the end of another year. For some, this is a time for introspection. Who has not, at sometime, looked back at the past year in their personal life, maybe reflecting upon what they accomplished, would have liked to accomplish, and what they did not accomplish? If you, … [Read more...]
Calculation Corner: Thermal Interactions Between High-Power Packages and Heat Sinks, Part 1
Bruce Guenin, PhD Associate Technical Editor The need to accommodate increasing chip power has led to improved package and heat sink designs having much lower thermal resistance values than previously. This has led to challenges in accurately calculating the thermal performance of the package and heat sink as an integral unit on the basis of thermal resistance measurements … [Read more...]
Thermal Facts and Fairy Tales: Fixed Temperature and Infinite Heatsinking
In keeping with the name of this column, the fact worth reminding is that a fixed temperature boundary condition in a thermal simulation represents an infinite heat sink. The systems that thermal engineers model and simulate have boundaries and thus require some type of specification, usually known as boundary conditions. Related to the other part of the name of this column, … [Read more...]
Open Bath Immersion Cooling In Data Centers: A New Twist On An Old Idea
Phil Tuma 3M Company, St. Paul, Minnesota The inefficiencies of legacy datacenter air cooling schemes are by now well known. New “Free Air” cooling technologies in which air is introduced to the racks in a facility or container and confined in hot and cold plena probably represent the pinnacle of air cooling efficiency, at least where climate permits them. However, development … [Read more...]
Keeping Moore's Law Alive
Peter E. Raad Southern Methodist University and TMX Scientific, Inc., Dallas, Texas A recent news item [1] described the intended efforts of researchers from IBM, EPFL, and ETH to “keep Moore’s Law for another 15 years.” Doing so, the article adds, “will require a change from mere transistor scaling to novel packaging architectures such as so-called 3D integration, the vertical … [Read more...]
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