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Identifying Thermal Bottlenecks and Shortcut Opportunities – Taking Simulation to the Next Level

 

Simulation has, to date, focused primarily on the prediction of an operating state that is compared to a design acceptable state to judge the compliance of that design. From an electronics cooling perspective that state is often taken as the operating temperature of packaged ICs, most commonly a case (Tc) or junction (Tj) temperature. FloTHERM has, over the last 21 years, … [Read more...]

editoral: why standardization is mandatory: on the incorrect use of thermal impedance in the TIM world

 

Clemens J.M. Lasance Editor-in-Chief, Fall 2010 Issue Some time ago I devoted my editorial to the problems caused by the veeerrryyy slow adherence to the use of SI units to which the U.S. committed itself in 1872. When talking globalization we should speak the same scientific language, and when there are conflicts of interest, logical reasoning should prevail to decide upon … [Read more...]

calculation corner: a spreadsheet based matrix solution for a thermal resistance network: part 1

 

Ross Wilcoxon Rockwell Collins Cedar Rapids, Iowa A thermal resistance network analysis begins by defining discrete points within a system, known as nodes, and the thermal resistance between each set of nodes.  Boundary conditions for external heat inputs and reference temperature(s) are applied to the appropriate nodes. Equations to relate nodal temperatures can be generated … [Read more...]

thermal facts and fairy tales: fully-developed channel flow: why is Nu constant?

 

Clemens J.M. Lasance Philips Research Laboratories Emeritus The last time the subject of my column was:  ‘Most of us don’t live in wind tunnels, neither in the world of Nusselt.’ I promised more comments about the (mis)use of the heat transfer coefficient h in real-life applications where we are dealing with multiple sources, anisotropic PCBs and multilayers. In this column … [Read more...]

creating PCB thermal conductivity maps using image processing

 

Byron Blackmore Mentor Graphics Corporation Introduction Thermal conduction into a printed circuit board (PCB) is often an important part of the critical heat transfer path in electronic devices. Efficiently capturing the effect of the heterogeneous and anisotropic nature of the PCB’s copper distribution on local thermal resistance in a simulation has long been a goal of the … [Read more...]

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