Surface mounted inductors with a rated current of 30 to 70 A contribute to the enhanced performance and downsizing of automotive ECUs Osaka, Japan – Panasonic Corporation announced today that its Industry Company has commercialized a low-loss and high vibration-resistant surface mounted automotive power inductor [1] (PCC-M15A0MF series). This 15.6 mm square inductor meets … [Read more...]
A Polyimide Single-Component Silver Filled, Electrically Conductive Semiconductor Die-Attach Adhesive
Creative Materials introduces 122-47, a polyimide single-component silver filled, electrically conductive semiconductor die-attach adhesive. This product can be applied by stamping, screen printing, dipping and syringe dispensing, and is designed for die-attachment and surface mount applications. Other applications include assembling electrical and electronic components. The … [Read more...]
Fujipoly® America 2022 Trade Show Schedule
Fujipoly® America announces its trade show schedule for the 2022 season. Speak with expert engineers at our 2022 trade shows to learn about the latest technological advances in thermal cooling to push your innovations to the next level. Fujipoly’s® high-performance thermal interface materials continue to deliver engineers and project designers unprecedented product … [Read more...]
Laird Thermal Systems Offers Online Thermoelectric Modeling Tool for PCR Design Engineers
The Thermal Wizard helps engineers simulate PowerCycling PCX Thermoelectric Coolers in PCR applications… Laird Thermal Systems, the world leader in thermal management solutions has launched an online simulation tool for PCR thermal cycling applications. Thermoelectric coolers designed for thermal cycling, such as the PowerCycling PCX Series, are used for Real-Time PCR to … [Read more...]
Edge Server-Design Considerations
Introduction This article provides an overview of Edge server trends, application, and design challenges for deployment in a harsh environment. The growing demand for compute speed, data bandwidth in modern IoT applications and AI-based time-sensitive critical applications are putting a heavy strain on cloud-based and centralized data centers. To meet these growing needs, the … [Read more...]
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