Thermal characterization plays a vital role in electronic package reliability testing, design, and verification of manufacturing processes. The reliability of electronic packages is controlled, in part, by ensuring the maximum junction temperature is not exceeded during operation. Systems such as cell phones, electric vehicles and computers, must operate with die temperatures … [Read more...]
Power Density In the Context of Two-Phase Immersion Cooling
Abstract Data centers face challenges in balancing space and power, with studies showing that when power density exceeds 7kW per rack, IT equipment space utilization drops to 50%. Traditional cooling methods are reaching limits due to increasing demands from deep learning and AI, necessitating more space. Two-phase immersion cooling offers simplicity and cost savings … [Read more...]
The Critical Radius in Cylindrical Systems
In the current world of heat transfer analysis, most work is performed with numerical simulation. However, there are analysis methods, which are faster and useful for early estimates or even design guidance, that are beneficial to thermal engineers. A recent ECM article [1] mentioned the concept of the critical radius when discussing the cooling/insulating effect of wire … [Read more...]
Thermal Analysis Methodology Best Practices
Thermal analysis: It’s a field that every mechanical engineer is exposed to during their undergraduate studies and many dabble in at some point during their professional careers. It’s also a field that some devote their full-time careers to as dedicated thermal engineers (or thermal analysts). Regardless of where in the broad spectrum of mechanical engineering work scope you … [Read more...]
Design Considerations for Chip/Package Level Bare Die Impingement Cooling for High Performance Computation Systems
Introduction of Bare-Die Jet Cooling in Package With the rising demand for more powerful, efficient, high-performance computation (HPC) systems, power densities of devices have increased dramatically. To cope with the increasing heat flux challenge for future data center servers beyond 1 kW/cm2, efficient liquid cooling solutions are needed to address those thermal … [Read more...]
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