Thermomechanical stresses and deformations are the major contributors to malfunctions of, and failures in, microelectronics and photonics devices, packages and systems. In microelectronics, the most serious consequences of the elevated thermal stresses are usually associated with mechanical (structural) failures (e.g., ductile rupture, brittle fracture, failures due to fatigue, … [Read more...]
Noise emission of telecommunication devices
Modern environmental requirements demand low noise levels for telecommunication cabinet products, especially when located in offices or urban areas. The spaces available are limited, and the power and electronics packaging density are increasing. Fans are commonly used to enhance the cooling of electronics by improving heat transfer due to higher air velocities. In this paper, … [Read more...]
Dimensional Analysis for Package Designers
The care with which we express the dimensions of important parameters makes the difference between conveying useful information or conveying useless or misleading data. Taking the issue of units one more step, the purpose of this article is to suggest that we occasionally organize our work to get rid of dimensions altogether. We must live in a dimensional world. A critical … [Read more...]
Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate
Although most of the emphasis today in the electronics cooling community is devoted to extending forced convection cooling capability, many applications still depend upon natural convection cooling. Basically, natural convection cooling combined with radiation is what results when a fan is not used in the cooling design to move air. Instead, movement of the air is induced by … [Read more...]
The Anisotropic Thermal Conductivity of Plastics
The easiest way to tailor thermal conductivity of plastics is to incorporate some highly thermal conductive filler material into the plastic molding compound. Here the filler particles act as heat carriers in the thermally isolating media. Roughly, if more filler is used, then higher thermal conductivity is achieved. Phenomena related to manufacturability and strength often … [Read more...]
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