Thermal test dies are among the major tools used in package thermal design qualification. They are usually simple chips, containing heaters and temperature sensors. The sensors measure the temperature on the chip surface as a result of the steady state powering or the time dependence of the temperature increase or decrease in case of transient qualification. From these data, … [Read more...]
The thermal conductivity of fluids
About 10-15 years ago, fluids, either directly (mainly Fluorocarbons), or indirectly (cold plates flushed with water) cooled the majority of mainframe computers. Nowadays, the expected increase in heat flux density causes a renewed interest in either passive or active liquid cooling, because the limits of air cooling come within reach. Other practical applications in which … [Read more...]
A system level cooling solution for cellular phone applications
Improving thermal performance of electronic components is very challenging due to the increasing power density and decreasing module sizes. The design trade off between electrical and mechanical characteristics and the cost of manufacturing MCM products requires innovative solutions to improve device thermal performance. The primary cooling path in portable electronics serves … [Read more...]
Application of Thermoelectric Coolers for Module Cooling Enhancement
Figure 1. Cooling power density for different T.E. cooler designs (adaped from Vandersande and Fleurial [6]). Introduction Many advances in computer technology have been made possible by increases in the packaging density of electronics. These advances began with the introduction of the transistor in 1947 and continue today with ultra-large scale integration at the chip level … [Read more...]
Determining the junction temperature in a semiconductor package, part III the use of the junction-to-board thermal characterization parameter
In recent issues, this column has dealt with the use of a number of thermal metrics to calculate the junction temperature of integrated circuits under various conditions. These metrics explored were JA, JC, and JT. To summarize the uses of these metrics: JA represents the junction-to-air thermal resistance for a package tested in an industry-standard test environment. It is … [Read more...]
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