A unique feature is included in TECA’s newest enclosure cooler series. The AHP-2259 Series of thermoelectric air conditioners will automatically accept 90 to 264 VRMS input. There are no adjustments to be made by the end user, the AHP-2259 coolers have a universal input power supply. This allows for increased versatility of use. The coolers can meet a wide range of input … [Read more...]
Thermoelectric Assembly Cooling for Temperature Control in CO2 Incubators
Laird has developed a smaller, more efficient option for precise thermal management in compact CO2 incubators using thermoelectric assemblies (TEAs). When employed with the advanced SR-54 temperature controller, thermoelectric assemblies use less energy to maintain the desired temperature range. A cell culture incubator is designed to maintain a constant temperature and high … [Read more...]
Surface Temperatures of Electronics Products: Appliances vs. Wearables
by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Prior to designing the requisite thermal management solution, engineers routinely calculate the junction temperatures of active and passive components using various methods at their disposal –finite difference grids, lumped parameter models, finite element methods, etc. The junction … [Read more...]
Comparison of Heatsinks used for the Thermal Management of LEDs
By James Pryde1,2, Weeratunge Malalasekera1, and David Whalley1 1Loughborough University 2Tamlite Lighting Introduction The work of Kraus & Bar-Cohen [1] and Bar-Cohen et al. [2] provide a well-defined foundation for the design and optimisation of conventional heatsinks. However, advances in manufacturing processes and increasing access to simulation tools provide new … [Read more...]
Book Review of Electronics Cooling (2016)
by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Electronics cooling engineers and designers are used to one constant in their professional lives: change. Most of it (as far as problem solving is concerned) is change for the worse… and is challenging! The heat flux keeps increasing, the geometries keep shrinking, the available solution … [Read more...]
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