Examples of state-of-the-art thermal management solutions at the dawn of the 21st century (left to right): a TCM module, a high-density heat sink, and an ultra performance, low profile fan-sink. Thermal management has served as a key enabling technology in the development of advanced microelectronic systems and has facilitated many of the "Moore's Law" [Moore, G.E., 1975] … [Read more...]
Ten stupid things engineers do to mess up their cooling
Editor's Note: On the eve of the new millenium, the editors of ElectronicsCooling have decided to depart from our normal serious tone just this once, unless, of course, we can convince Tony to contribute another story or two for us sometime [soon!] in the next thousand years. Herewith, for your amusement and edification is a humorous, yet insightful, retrospective of famous - … [Read more...]
Adjusting temperatures for high altitude
Many companies design products with electronics that must function reliably at high altitude, typically 1,500m (5,000 ft) or 3,000m (10,000 ft) above sea level. Estimating the increase in operating temperatures is necessary to design and qualify such products. There are a variety of corrections used to account for this effect, many of which sacrifice accuracy for simplicity. … [Read more...]
Design and reliability considerations in avionics electronics packaging
In the avionics industry, regulatory agencies and standards organizations, such as Federal Aviation Regulation (FAR) [1], Aeronautical Radio, Inc. (ARINC) [2], and Radio Technical Commission for Aeronautics (RTCA) [3], have developed sets of test procedures that help design engineers test and verify their designs and prevent any safety-threatening failures. Too often, however, … [Read more...]
Determining the junction temperature in a plastic semiconductor package, part II
In the majority of applications involving plastic surface-mount packages, most of the heat generated by integrated circuits will flow to the printed circuit board (PCB) by way of the package leads and then to In higher-power applications it is often necessary to attach a heat sink to the top of the package to keep the junction temperature of the chip within specified limits. … [Read more...]
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