Almost everyone working on pressure drop coefficients of perforated plates encounters the work of I.E. Idelchick {1}. A plethora of graphs or equations - some of which are impossible to evaluate quickly - must then be addressed. To simplify this issue for the reader, this month's Technical Data page has been designed to provide an overview of this information. When focusing on … [Read more...]
The thermal conductivity of silicon
The most important material within the semiconductor industry is Silicon. When dealing with electro-thermal device modelling, or the interpretation of fast transient techniques for the measurement of thermal impedance, thermal conductivity of Silicon is required. For steady state thermal analyses at the board and system level, however, accurate values are not required, because … [Read more...]
Calculating Spreading Resistance in Heat Sinks
Accident? Consider the scenario where a designer wishes to incorporate a newly developed device into a system and soon learns that a heat sink is needed to cool the device. The designer finds a rather large heat sink in a catalog which marginally satisfies the required thermal criteria. Due to other considerations, such as fan noise and cost constraints, an attempt to use a … [Read more...]
Convection and radiation
In last issue's calculation corner,a simple 1-dimensional conduction calculation was described. This time, we look at the other two basic heat transfer processes, namely convection and radiation. In actual applications with multiple heat sources with complicated geometries, the effect of each of these mechanisms on the heat transfer process can be quite difficult to calculate. … [Read more...]
Experimental evaluation of the local convective heat transfer from configurations of wall-mounted cubes in a channel flow
Figure 1: Sketches of the measurement cube. Introduction Computational fluid dynamics (CFD) codes are frequently used as design tools to predict the thermal processes in electronic circuitry. CFD codes can easily cope with a high level of complexity (component, board and system levels) which makes them attractive to use. However, the thermal and kinematic complexity of the … [Read more...]
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