Introduction Plastic components are designed so that the heat is dissipated by forced or natural convection. The use of plastic packages under conditions where neither cooling method is available introduces new challenges. High heat-dissipation plastic packages require a large-area solid heat sink in order to transfer the heat into the copper thermal lands on the printed … [Read more...]
Thermal management of handheld telecommunication products
Introduction Recent advances in mobile communications have enabled large scale development of handheld telecommunication products. Such products include cellular phones, pagers, two-way radios, personal digital assistants (PDAs), and other wireless and wireline equipment. The technological enhancements at device, package, and system levels have resulted in increased … [Read more...]
Measuring fluid velocity in electronic enclosures
Thermal analysis and characterization of electronic systems requires a knowledge of fluid velocity. In pursuit of this information, we often resort to measurement or calculation. The issue of measurement becomes a challenge since we are dealing with rather complex flows that tend to be highly nonisothermal. Therefore, it is our intention in this article to highlight the need … [Read more...]
The coefficient of thermal expansion
This is the second technical data feature that deals with the coefficient of thermal expansion (CTE). The first technical data feature, incorporated in the September 1997 issue, covered semiconductor materials, leadframes and solder alloys. This issue will discuss the temperature dependence of the CTE and present data on other materials that are of importance to electronic … [Read more...]
Thermal management of outdoor enclosures using phase change materials
Telephone equipment has traditionally been housed in large buildings, sheds and outdoor cabinets. The cooling of these facilities has been carried out using traditional methods. However, in many of the new systems being developed and deployed such as broadband ISDN, cellular and/or cable, heat dissipation densities will increase substantially [1]. Furthermore, the introduction … [Read more...]
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