(July 18, 2016) The complimenting research done by Oak Ridge National Laboratory and the University of Tennessee Knoxville has found a way to improve the heat dissipation in electronics using 3D printing. According to 3DPrint.com, “[Oak Ridge] researchers are showing that 3D printed aluminum may be a more viable source for conducting heat than traditional materials. And at … [Read more...]
3D Printed Smartphone Case to Include Cooling Fans for Sustained Pokemon Go Play
(July 18, 2016) A 3D printed smartphone case that may better support and cool smartphones has recently been designed and prototype printed. Made to look like a real life Pokédex, SparkFun user NPOOLE created the battery pack with the intention of helping Pokemon Go players play for longer amounts of time. The case fits a Samsung Galaxy S4 and “hides a 2,600 mAh battery pack” … [Read more...]
Electric Cars Will Not Meet the Same Fate as HoverBoards’ Overheated Batteries
(July 11, 2016) Where electric cars and hoverboards both use lithium-ion cells, electric cars will have a more diligent manufacturing process and thus more heat control. According to blog CarAndDriver.com, “Automotive-grade cells are very, very different [from the cheaply made hoverboards’]: meticulously manufactured, precisely temperature-controlled lithium-ion and … [Read more...]
3D Printed Heat Sink Performs as Well as Conventional Heat Sinks with Annealing Process
(July 8, 2016) Recently, Tong Wu, of the University of Tennessee and Oak Ridge National Laboratory, led a team of researchers who have discovered that manufacturers can create 3D printed heat sinks that can perform as well as conventional heat sinks by employing an annealing process. The research project compared the performance of 3D printed aluminum heat sinks to non-printed … [Read more...]
Calculation Corner: Estimating The Effect Of Flow Bypass On Parallel Plate-Fin Heat Sink Performance
by Bob Simons – Reprinted from ElectronicsCooling, Feb., 2004 [Formatted by B. Guenin, 4/4/16] In past issues of ElectronicsCooling, methodologies were presented for estimating parallel plate-fin heat sink thermal resistance [1] and pressure drop [2]. The underlying assumption for both articles was that all the flow delivered by the fan is forced to go through the channels … [Read more...]
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