(June 3, 2016) Because electronics have shrunk significantly in recent years, the solutions to cool them must be adjusted. Electropages.com suggests “a case-specific analysis must be performed as each application is subject to different circumstances,” to determine the right strategy for cooling electronics. This analysis is called “CFD analysis,” or computational fluid … [Read more...]
Laser Storage in Data Centers Could Mean Less Heating
(June 3, 2016) Davide Bossini from the University of Tokyo has found a possible solution to control the demand for smaller, faster, devices to store, manage, and process data in data centers without compromising cooling. “A way to store information in a particularly tiny area is by taking advantage of the fact that individual electrons possess magnetization, which is called … [Read more...]
New Method for Doping Single Crystals of Diamond Discovered
(May 24, 2016) Researchers at the University of Wisconsin-Madison have recently introduced a new method for doping to bring diamonds a step further as semiconductors. Doping is a “process in which other elements are integrated into the semiconductor to change its properties,” explained Phys.org, and “because of diamond's rigid crystalline structure, doping is difficult.” But … [Read more...]
Thermoelectric Modules That Achieve Higher Heat Flux Densities For Cooling Industrial Lasers
Laird has recently developed a high heat flux density thermoelectric module (TEM) designed to achieve a higher heat pumping capacity than standard TEMs, called UltraTEC. “The UltraTEC Series TEM has a heat pumping capacity up to 340 watts, which is ideal for larger cooling applications with limited surface area such as industrial lasers,” claimed Laird. It also has a “precise … [Read more...]
Thermal Simulation Tool for Design Engineers Available
In recent years, Cradle has created and launched an easy to use, real-time, printed circuit board thermal analysis tool for electrical designers, called the Cradle PICLS. PICLS enables electrical designers to instantly evaluate how changes to circuit board design affect thermal performance, thus reducing downstream rework. Analysis data can be passed seamlessly from the PCB … [Read more...]
- « Previous Page
- 1
- …
- 13
- 14
- 15
- 16
- 17
- …
- 126
- Next Page »
