In the current world of heat transfer analysis, most work is performed with numerical simulation. However, there are analysis methods, which are faster and useful for early estimates or even design guidance, that are beneficial to thermal engineers. A recent ECM article [1] mentioned the concept of the critical radius when discussing the cooling/insulating effect of wire … [Read more...]
Thermal Analysis Methodology Best Practices
Thermal analysis: It’s a field that every mechanical engineer is exposed to during their undergraduate studies and many dabble in at some point during their professional careers. It’s also a field that some devote their full-time careers to as dedicated thermal engineers (or thermal analysts). Regardless of where in the broad spectrum of mechanical engineering work scope you … [Read more...]
Design Considerations for Chip/Package Level Bare Die Impingement Cooling for High Performance Computation Systems
Introduction of Bare-Die Jet Cooling in Package With the rising demand for more powerful, efficient, high-performance computation (HPC) systems, power densities of devices have increased dramatically. To cope with the increasing heat flux challenge for future data center servers beyond 1 kW/cm2, efficient liquid cooling solutions are needed to address those thermal … [Read more...]
How Many Ways Can Temperature Affect Performance and Reliability of Electronic Systems?
Thermal management in high performance electronics has become a leading challenge for design and reliability engineers. Harsh temperatures can be caused either by harsh operational conditions (high power dissipation), or by harsh environmental conditions. Both require adequate thermal management to ensure that the product temperature stays within acceptable limits. High … [Read more...]
Adding Function, Value, and Performance to Direct-to-Chip (DTC) Cold Plates With Ultrasonic Additive Manufacturing
Lance Dumigan Fabrisonic, LLC Mark Norfolk Fabrisonic, LLC Practical Knowledge Gained “The performance of DTC cold plates can be enhanced by a new method of fabrication called Ultrasonic Additive Manufacturing (UAM). Building DTC cold plates with UAM could enhance performance and functionality.” The direction of Artificial intelligence and High Power Computing … [Read more...]
