Plunkett Associates has successfully redesigned heat-sinks to improve convection cooling performance using Direct Metal Laser Sintering (DMLS), or 3D printing. “Each heat-sink was first produced in virtual form and simulated using Computational Fluid Dynamics (CFD) software,” reported 3Ders.org. “The top five heat-sinks were then built by 3T RPD Ltd. using DMLS and physically … [Read more...]
Protection Coatings for Coolers to be Presented at Upcoming Conference
On February 26 at the Photonics West Conference in San Francisco Rogers Corporation’s Power Electronics Solutions (PES) will be presenting a report on ACT’s vapor-deposited Applied Nanoscale Corrosion Resistant (ANCER™) coatings in partnership with Advanced Cooling Technologies. According to the company, the thin, conformal ANCER coatings “help extend the operating life of … [Read more...]
New Hybrid Adhesives Use UV Cure and Heat Cure Combination
Epoxy Technology Inc. has released a new line of UV Hybrid adhesives. The company says these adhesives allow “engineers to reach new levels of production/process improvement” and afford “greater design flexibility.” They use “a primary UV cure for tacking, followed by a secondary heat cure for completion,” according to Epoxy, “This unique combination affords engineering … [Read more...]
New Design for Fighter’s Thermal Management Tech
Northrop Aerospace Systems has released a new artistic concept of a sixth-generation fighter that will combine new technology present in the Lockheed Martin F-22 and B-2 with new thermal management technology. According to FlightGlobal.com, Northrop president Tom Vice is putting new focus on the quality of managing the heat generated by future weapons and sensors as it has … [Read more...]
Tech Brief – Low Electrical Conductivity Liquid Coolants for Electronics Cooling
By Bojanna Shantheyanda, Sreya Dutta, Kevin Coscia and David Schiemer Dynalene, Inc. 1.0 Introduction Liquid cooling, which can be achieved using indirect or direct means, is utilized in electronics applications having thermal power densities that may exceed safe dissipation through air cooling. Indirect liquid cooling is where heat dissipating electronic components are … [Read more...]
- « Previous Page
- 1
- …
- 22
- 23
- 24
- 25
- 26
- …
- 126
- Next Page »
