By Satish G. Kandlikar1,2 and Arvind Jaikumar2 1Mechanical Engineering Department, Rochester Institute of Technology, 76 Lomb Memorial Dr., Rochester, NY 14623, USA; 2Microsystems Engineering Department, Rochester Institute of Technology, 168 Lomb Memorial Dr., Rochester, NY 14623, USA The advancements in microelectronics and micro-electro-mechanical systems (MEMS) devices to … [Read more...]

By Robert E. Simons, IBM Corporation Editor’s note: In recognition of the 20th year of ElectronicsCooling, we are republishing articles from past issues that we believe to be of particular value to our readership.  The following article was published in the February 2003 issue as a Calculation Corner authored by Bob Simons.  Bob served as an Associate Technical Editor of this … [Read more...]

By Yogesh Fulpagare and Atul Bhargav Energy Systems Research Laboratory, Indian Institute of Technology Gandhinagar, India With the advancement of technology, the access to information has become rapid as well as ubiquitous.  These mammoth resources which can be accessed through one click are stored and processed in data centers.  These data centers are one of the largest and … [Read more...]

By Victor Chiriac1, Steve Molloy1, Jon Anderson1, Ken Goodson2 1 Qualcomm Technologies, Inc., 2 Stanford Mechanical Engineering Introduction With smart phones and other mobile devices available in a variety of sizes and shapes, it is challenging to think in a consistent and comparative manner about the effectiveness of the thermal management solutions that they employ.  This … [Read more...]