By: Yong Quiang Chi, Peter Hopton and Keith Deakin, Iceotope Ltd Jonathan Summers, Alan Real, Nik Kapur and Harvey Thompson, University of Leeds Introduction Improvements in energy efficiency and performance of data centers are possible when liquid is supplied to the racks [1]. A solution which has become popular for dense racks is the rear-door water-cooled heat … [Read more...]
Comparison of HPC and Telecom Data Center Cooling Methods by Operating and Capital Expense
By: Dr. Alexander Yatskov; Thermal Form & Function Inc. Introduction Current high-performance computing (HPC) and Telecom trends have shown that the number of transistors per chip has continued to grow in recent years, and data center cabinets have already surpassed 30 kW per cabinet (or 40.4 kW/m2) [1]. It is not an unreasonable assumption to expect that, in accordance … [Read more...]
Thermal Power Plane Enabling Dual-Side Electrical Interconnects for High-Performance Chip Stacks
Thomas Brunschwiler, Gerd Schlottig, Hubert Harrer and Stefano Oggioni Abstract In this report, the design and performance of a thermally enhanced laminate called thermal power plane (TPP) is reported. It enables dual-side electrical interconnects to a chip stack and thus supports increased communication bandwidth and power density. In addition, in a two-die stack, all … [Read more...]
Liquid Immersion in the Data Center: A Modular Approach for Cooling High-Performance Microelectronics
Introduction While data enter energy consumption is already significant, the growth of a global cloud-based economy along with society’s need for constant social networking connectivity will cause this number to rise even further. The world’s Information-Communications-Technologies (ICT) infrastructure, a general representation of cloud-based computing, is estimated to … [Read more...]
Design Optimization of a Multi-Device Single-Phase Branching Microchannel Cold Plate
Ercan M. Dede INTRODUCTION Single-phase liquid cooling is an established approach to the thermal management of highly-reliable hybrid vehicle power electronics. However, as the electrification of hybrid vehicles increases and under-hood space becomes further constrained, semiconductor device power densities continue to rise (in excess of 200 W/cm2) resulting in … [Read more...]
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