Wendy Luiten Philips Research, Eindhoven, the Netherlands INTRODUCTION Active LEDs in a consumer TV product are boosted and dimmed with the video picture content. Boosting and dimming of the LEDs is a powerful means to improve visual experience, either through application of active LEDs in an ambient light feature, or through dimming and boosting of the display LEDs in a … [Read more...]
Challenges in Measuring Theta jc for High Thermal Performance Packages
Jesse Galloway and Ted Okpe Amkor Technology One of the more challenging thermal resistance measurements to make for electronic packages is the junction-to-case resistance called Theta jc. The equation for Theta jc, equation (1), is straightforward. However, the difficulty lies in making an accurate case temperature, Tc, without affecting the junction temperature, Tj, and the … [Read more...]
Estimating the Thermal Interaction between Multiple Side-by-Side Chips on a Multi-Chip Package
Je-Young Chang and Ashish Gupta Intel Corporation INTRODUCTION Integration using multi-chip packaging (MCP) is an effective and popular technology option to increase transistor density in one component by integrating two or more dice or other discrete components on a common substrate. For accurate thermal analyses of MCPs, thermal interactions between active components need … [Read more...]
Scientists Achieve First Measurement of Moly’s Thermal Conductivity
Scientists at the National Institute of Standards and Technology’s Physical Measurement Laboratory have succeeded in measuring the thermal conductivity for the first time of an ultra-thin material that is expected to play a major role in the developing field of nanoelectronics. Molybdenum disulfide, also known as molybdenite or “moly” for short, is a 2D material that measures … [Read more...]
New Thermal Interface Protocol Standard for 3D-ICs
The Silicon Integration Initiative (Si2) has announced the release of a new chip thermal interface protocol (CTIP) standard for three-dimensional integrated circuits (3D-IC) under the auspices of the Open3D Technical Advisory Board (TAB). The Open3D TAB is chartered to define open standards for design data formats and interfaces to enable interoperable 2.5D and 3D design … [Read more...]
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