Je-Young Chang and Ashish Gupta Intel Corporation INTRODUCTION Integration using multi-chip packaging (MCP) is an effective and popular technology option to increase transistor density in one component by integrating two or more dice or other discrete components on a common substrate. For accurate thermal analyses of MCPs, thermal interactions between active components need … [Read more...]
Scientists Achieve First Measurement of Moly’s Thermal Conductivity
Scientists at the National Institute of Standards and Technology’s Physical Measurement Laboratory have succeeded in measuring the thermal conductivity for the first time of an ultra-thin material that is expected to play a major role in the developing field of nanoelectronics. Molybdenum disulfide, also known as molybdenite or “moly” for short, is a 2D material that measures … [Read more...]
New Thermal Interface Protocol Standard for 3D-ICs
The Silicon Integration Initiative (Si2) has announced the release of a new chip thermal interface protocol (CTIP) standard for three-dimensional integrated circuits (3D-IC) under the auspices of the Open3D Technical Advisory Board (TAB). The Open3D TAB is chartered to define open standards for design data formats and interfaces to enable interoperable 2.5D and 3D design … [Read more...]
Thermally Conductive Epoxy for Aerospace, Electronics and OEM Industries
Master Bond has introduced EP46HT-1AO, a two-component, thermally conductive epoxy formulated for bonding and sealing applications in the aerospace, electronic and specialty OEM industries. EP46HT-1AO combines thermal conductivity and electrical insulation properties. This dimensionally stable system provides a tensile strength over 7,500 psi, a compressive strength of 26,000 … [Read more...]
Advances in Vapor Compression Electronics Cooling
INTRODUCTION Over the last 10 years, there has been a well-documented increase in the energy density of electronic devices. As this energy density has gone up, so has the heat dissipation on electronics packages. In response to this challenge, significant research has taken place to develop chip level cooling systems to meet heat fluxes in excess of 1000W/cm2. As stated … [Read more...]
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