Alex Kampl Allied Control Company Abstract Recently, Bitcoin and Bitcoin mining have aroused international interest. This article describes the cooling challenges faced by Bitcoin miners and discusses the implications on the future of cooling for supercomputers, HPC clusters and other high density electronics. We explain the inner workings of the first commercial open … [Read more...]
Potential Pitfalls of Hybrid Electrical-Thermal Measurements for Thermal Characterization
Anurag Gupta, David H. Altman, Daniel P. Resler Raytheon Integrated Defense Systems Introduction Electrical resistors are often used to simulate heat-dissipating electronic devices in thermal characterization of semiconductor devices. This article describes a study in which test measurements and analysis were conducted in steady-state conditions to characterize the thermal … [Read more...]
Prehistoric Cave Paint to Shield Solar Spacecraft
A European spacecraft scheduled for launch towards the sun in 2017 will be shielded from extreme temperatures by a type of paint once used in prehistoric cave art. Carrying instruments to perform high-resolution imaging of the sun, the European Space Agency’s Solar Orbiter will travel as close as 42 million kilometers, or a little more than a quarter of the distance to Earth, … [Read more...]
Apple Files Patent for Smaller, Quieter Wireless Cooling Fan
A patent application filed by Apple hints at the company’s latest plan to bypass design limitations and shrink their devices even more. While the technology company strives to develop increasingly lighter and thinner products, certain components limit how thin and light the company can make their devices. One such component is the cooling fan, an essential thermal management … [Read more...]
Heat Sink Series Provides Modular Cooling Options for Electrical Components
Ohmite Manufacturing, a provider of thermal solutions and resistors, has released its new B60/C60 heat sink system ideal for use with high power density and small size (3U or 4U) electronic packaging with forced convection. The new B60/C60 heat sink system provides designers with a variety of cooling options for up to six TO-246 or TO-264 devices, such as TO-247 and TO-264 … [Read more...]
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