Man Prakash Gupta and Satish Kumar G.W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology INTRODUCTION Due to the growing demands of higher performance and faster computing, the number of cores in a microprocessor chip has been increasing consistently. The transition from single core to multi-core technology has already been observed in the past few … [Read more...]
Use of JEDEC Thermal Metrics in Calculating Chip Temperatures (without Attached Heat Sinks)
Bruce Guenin Assoc. Technical Editor, Electronics Cooling INTRODUCTION JEDEC single-chip package thermal metrics are widely used as a means of characterizing the thermal performance of semiconductor packages. They correlate the peak temperature of a uniformly-heated semiconductor chip (the junction temperature, TJ) with the temperature of a specified region along the heat … [Read more...]
Mobile Temperature Control System for Fast Thermal Testing of Electronics
InTEST Thermal has released a new mobile temperature control system for high-speed thermal testing of electronics, sensors and assemblies. The Thermostream ATS-535 brings temperature to the test site by directing a stream of cooled or heated air, quickly reaching temperatures between -60 to +225°C. Highly mobile and capable of functioning without the need for an external air … [Read more...]
Electrocaloric Effect May Yield More Effective Cooling Systems
British scientists are hoping to replace chemicals used in modern cooling systems with more environmentally-friendly materials that change temperature with the application of electricity. Known as the electrocaloric effect, previous research from 2006 has shown that the phenomenon can be used in cooling applications. According to researchers at the National Physical … [Read more...]
Highly-Conformable Gap Filler Pad with Reinforced Mesh Center
Fujipoly America Corporation has released its new Sarcon25GR-T2d thermal interface material, a soft, highly-conformable gap filler pad with a reinforced mesh center ideal for applications that require a thermal interface bridge across larger surface areas. Once installed, the TIM delivers a thermal conductivity of 1.5 W/m°K per ASTM D2326 and a thermal resistance of 0.40 … [Read more...]
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