U.S. Air Force officials have awarded multimillion dollar contracts to BAE Systems and Boeing Co. as part of DARPA’s Intrachip/Interchip Enhanced Cooling Applications (ICECool Applications) program. The ICECool program seeks to develop advanced electronics cooling techniques for high-performance embedded computer (HPEC) and RF monolithic microwave integrated circuit (MMIC) … [Read more...]
Sony Releases Source Code for Thermal Management Solution
Consumer electronics provider Sony has released the source code for Thermanager, a thermal management solution developed for and used in the company’s Android Open Source Project (AOSP) for Xperia projects. The source code is available through the Sony channel on GitHub. “Since the first release of Android Open Source Project (AOSP) for Xperia devices, thermal management for … [Read more...]
Webinar Question & Answer Session
Editor’s note: This question was asked in response to Electronics Cooling’s recent webinar by Carl Zwebin. To view the webinar, click here. Question: Are these graphite based materials compressible? Answer: In general, they are not compressible. However, exfoliated natural graphite is compressed during the manufacturing process used to make thermal interface materials and … [Read more...]
Waterproof Tablet Computer Features Cooling Fan
Electronics manufacturer Fujitsu has released a unique new tablet computer capable of operating underwater while using a cooling fan to pump heat away from sensitive internal circuitry. The Arrows Tab QH77/M is 2-in-1 computer that can be used both as a clamshell notebook computer and as a tablet computer when the display unit is detached. The casing houses an Intel Core … [Read more...]
Thermal Connectors Improve PCB Assembly Heat Dissipation
TEM Products Inc., a manufacturer of mechanical components for electro-mechanical assembly, has released its new patent-pending PowerPeg thermal connectors. Designed for attachment to an external dissipater, the new PowerPeg thermal connectors offer significantly improved thermal conductivity compared to traditional PCB heat spreading methods by allowing heat to dissipate more … [Read more...]
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