Scientists, at the Vienna University of Technology have developed a new class of thermoelectric materials they claim can be used to create electricity more efficiently. According to the researchers, the material’s unique structure, which consists of countless tiny magnetic crystal “cages” known as clathrates with cerium atoms enclosed inside, is the key reason for its increase … [Read more...]
Patent Covers Methods of Making, Cooling Semiconductor Packages
The U.S. Patent and Trademark Office has awarded patent No. 8,546,935, “Semiconductor Packages,” to Micron Technology, Inc. of Boise, Idaho. According to background information provider by the inventors, the patent covers “semiconductor packages having grooves within a semiconductor die backside, and includes semiconductor packages utilizing carbon nanostructures (such as, for … [Read more...]
New Patent Covers System for Clamping Heat Sink
The U.S. Patent and Trademark Office has assigned patent No. 8,546,192, “System for Clamping Heat Sink,” to Harman International Industries, Inc. in Stamford, Conn. According to the background information provided by the inventor, the patent covers “a system for clamping a heat sink that prevents excessive clamping force. The system may include a heat sink, a semiconductor … [Read more...]
View our Webinar and Q&A on ‘Advanced Carbon-Based Thermal Management Materials and Applications ’
On September 25, 2013, Carl Zweben presented a live webinar on Advanced Carbon-Based Thermal Management Materials and Applications. Overview: In this webinar, we consider advanced carbonaceous (carbon-based) materials, which are now well established, and are being used in a large and increasing number of commercial and aerospace/defense applications. Examples include various … [Read more...]
Thin Film Thermal Conductivity Measurement using a Micropipette Thermocouple
R. Shrestha, K. M. Lee and T. Y. Choi - University of North Texas D. S. Kim - POSTECH INTRODUCTION Due to the required experimental characterization complexity for the thermal conductivity measurement of thin films, accurate measurement of such materials has been difficult to achieve for thicknesses less than 1 µm. For example, conventional Fourier heater plate … [Read more...]
- « Previous Page
- 1
- …
- 39
- 40
- 41
- 42
- 43
- …
- 126
- Next Page »
