The U.S. Patent and Trademark Office has assigned patent No. 8,546,192, “System for Clamping Heat Sink,” to Harman International Industries, Inc. in Stamford, Conn. According to the background information provided by the inventor, the patent covers “a system for clamping a heat sink that prevents excessive clamping force. The system may include a heat sink, a semiconductor … [Read more...]
View our Webinar and Q&A on ‘Advanced Carbon-Based Thermal Management Materials and Applications ’
On September 25, 2013, Carl Zweben presented a live webinar on Advanced Carbon-Based Thermal Management Materials and Applications. Overview: In this webinar, we consider advanced carbonaceous (carbon-based) materials, which are now well established, and are being used in a large and increasing number of commercial and aerospace/defense applications. Examples include various … [Read more...]
Thin Film Thermal Conductivity Measurement using a Micropipette Thermocouple
R. Shrestha, K. M. Lee and T. Y. Choi - University of North Texas D. S. Kim - POSTECH INTRODUCTION Due to the required experimental characterization complexity for the thermal conductivity measurement of thin films, accurate measurement of such materials has been difficult to achieve for thicknesses less than 1 µm. For example, conventional Fourier heater plate … [Read more...]
To What do you Attribute the Success of Al/SiC?
Editor’s note: This question was asked in response to Electronics Cooling’s recent webinar by Carl Zwebin. To view the webinar, click here. Question: To what do you attribute the success of Al/SiC? Answer: Al/SiC composites have attractive properties, including low CTEs, thermal conductivities in the range of aluminum alloys and low densities. In addition, the raw … [Read more...]
Electronics Cooling September 2013 Issue Now Online
Don’t miss out on the September 2013 issue of Electronics Cooling, which includes feature articles on Heat Pipe Integration Strategies for LED Applications; Testing of power LEDs: The latest thermal testing standards from JEDEC, as well as a calculation corner and technical briefs. If you would like to receive your free copy of Electronics Cooling click here to subscribe. Read … [Read more...]
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