Researchers at MIT have found that relatively simple, microscale roughening of a surface can dramatically enhance its transfer of heat by more than doubling the maximum heat dissipation. To test the process, the researchers made a series of postage-stamp-sized silicon wafers with varying degrees of surface roughness. They found that systematically increasing roughness led to a … [Read more...]
Designing Heat Sinks When a Target Pressure Drop and Flow Rate is Known
Forced convention air cooled heat sinks and liquid cooled cold plates are quite pervasive in their use in electronics cooling applications. While there can be significant debate on whether to air or liquid cool a particular component, the approach a thermal engineer would adopt to design both components is essentially similar. Parallel plate fins are the most common geometry … [Read more...]
3D Fluid-Flow Analysis Software
TriStar increases its expertise in the CAD design market by taking part in the area of pre-physical prototype production. The Mentor Graphics® FloEFD™ product is a full-feature 3D fluid-flow analysis package that enables engineers to turn computational fluid dynamics (CFD) analysis into a plug in for CAD systems. This allows users to create virtual models of their designs, … [Read more...]
Calculation Corner: Transient Modeling of a High Power IC Package, Part 2
Part 1 can be found here. Part 1 of this article provided the groundwork for the present discussion [1]. It demonstrated the use of three different methodologies for performing a transient thermal analysis of a high-power IC package attached to a heat sink. These include the finite element analysis (FEA) method and a numerical model, which represents the package and heat sink … [Read more...]
Thermal Facts & Fairy Tales: Heat Spreading Revisited
AS PROMISED IN MY editorial of the 2011 Fall issue, I will devote this issue’s column on the topic of heat spreading. The reason is that I, while writing a white paper on basic thermal management for LED applications, found some unexpected facts pointing at problems of interpretation of heat spreading data for dual layers when using the often-used heat spreading equations. In … [Read more...]
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