Just a quick post to let you know yours truly will be giving a presentation on: Thermal Design: A Key Part of the Electronics Design Flow At the UK Solutions Expo at the Heritage Motor Centre in Gaydon on 12th November. Miniaturization continues to increase power densities at all packaging levels, forcing design teams to identify new methods of cooling. The challenge remains … [Read more...]

The simplest of compact thermal models (CTMs) is a one resistor type. Of these the most widely quoted is Theta_ja (ok, ok, and Theta_jma, more on that variant later). Knowing the power dissipation of the component as well as the ambient temperature is in theory all that is required to determine the junction temperature from the supplied Theta_ja resistance value. You would … [Read more...]

I read in the news this last week that Sir Tim Berners-Lee, a Brit and the inventor of the World Wide Web, has confessed that the // in a web address were actually “unnecessary”… and it seems that polar ice will be gone in the summer, perhaps by as early as 2020, opening the arctic ocean to shipping. At the same time I’m writing this on my laptop, the fan’s just … [Read more...]

Lumped block package representation makes the best use of limited available data to simulate for an ‘indication’ of case temperature. Some indication is better than none but I wouldn’t bet on it, really, I wouldn’t. Accurate case and junction temperature prediction can only be realised with either a fully 3D detailed representation or an abstracted CTM … [Read more...]

Hmmm… If you’re guessing it’s a chip package, you’re right – got it in one. Well done! OK, so what type of package is it? If you’re thinking it’s a silly question as you don’t know anything about the package, other than I’ve told you its black - that was a hint that it’s an encapsulated plastic part by the way - you’d be right. You’d need me to tell you if it had leads, and if … [Read more...]