Introduction Numerous reports over the past ten years or so have described the potential for nanofluids (suspensions of nanoparticles in liquids) to be applied as heat transfer fluids, because of the enhanced thermal conductivity and convective heat transfer characteristics that have generally been observed. A number of review articles have been published on nanofluids [1 � 8], … [Read more...]
When Moore Is Less: Exploring the 3rd Dimension in IC Packaging
Introduction As consumers of electronics we have become spoiled. We not only expect our electronic devices to get smaller, faster, more functional, cheaper, more interconnected, and more reliable, we actually demand it. It would not be a pretty picture either for the consumer or the electronics industry if suddenly the design of our electronic gadgets became static. At this … [Read more...]
A Cryocooler In Your Laptop Computer? Maybe…
Introduction A review of the technical and market impediments overcome in the development and eventual acceptance of cryocoolers for space-borne applications may shine light on the prospects for the use of such mechanical refrigeration systems in more widespread commercial uses. This premise is explored by first reviewing space cooler development history, then considering some … [Read more...]
Power Map Calculations Using Image Sources and Superposition
Introduction In the past, thermal engineers were content to calculate a single junction temperature in the thermal characterization of an integrated circuit chip in a package. In recent years, as power levels have increased, more attention has been paid to the calculation of local temperature variations on a chip. This is necessary to adequately account for high-heat-flux … [Read more...]
Heat Spreading Calculations Using Thermal Circuit Elements
Heat Spreading Calculations Using Thermal Circuit Elements Bruce Guenin, Associate Technical Editor Introduction In electronics cooling applications, there are numerous changes of scale from the chip level to the system level. This is characteristic of the signaling, power, and thermal infrastructures in electronic systems. Because of this, it is inevitable that the heat flow … [Read more...]
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