Introduction Many liquid cooling solutions in use today employ cooling system devices that result in system pressure drops limited to <0.5 bar (7.25 psi), which allows these systems to fit within the limits of centrifugal pumps. The evolution of alternative cooling devices has brought about pressure drop requirements >1.0 bar (14.50 psi) in some cases [1]. These higher … [Read more...]
Providing More Value Than Playing Video Games
ElectronicsCooling magazine was founded more than 12 years ago with a mission of providing current and practical thermal management information with archival value. I hope you agree this magazine is still delivering on its original promise. The last word in the mission statement is value, and each of us, as a thermal engineer, desires to add value to our projects. Admittedly, … [Read more...]
Thermal Effusivity
The Technical Data column of the previous issue discussed the concept of thermal diffusivity. It makes sense to discuss in this issue a related topic: thermal effusivity. While thermal diffusivity, a, is defined as the ratio between the thermal conductivity, k, and the volumetric thermal capacity, ρcp, the effusivity, e, is related to their product, as follows: It is … [Read more...]
Air-Cooled, Pin Fin Coldwall Design For Operation At Altitude
Introduction Numerous thermal management techniques exist depending on the system, application, and power level. For airborne electronic systems, the most direct approach to thermal management would be to use ambient air or chilled air, provided by the aircraft, routed to and blown across the electronics. However, in some applications potential contaminants in the cooling air, … [Read more...]
Comparison Of Heat Transfer Rates Of Different Nanofluids On The Basis Of The Mouromtseff Number
Nanofluids are dispersions of nanometer-sized particles in a base fluid such as water, ethylene glycol or propylene glycol. In the last decade, nanofluids have attracted more attention as a new generation of coolants for various industrial and automotive applications. Use of high thermal conductivity metallic nanoparticles (e.g., copper, aluminum, silver, gold, etc.) … [Read more...]
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