Introduction Traditional cooling approaches, consisting typically of external air-cooled heat sinks, are increasingly falling short in meeting the thermal management challenges of emerging electronic systems. Integrated cooling designs are being investigated to eliminate some of the interface contact resistances introduced by add-on heat sinking and to minimize package … [Read more...]
On-Chip Electrowetting Cooling
Introduction Control of component temperatures and temperature gradients is essential for the successful operation and reliability of electronics products [1]. However, conventional cooling methods, such as natural convection or fan-induced air-cooling, cannot cope with the increasing demand for electronics cooling. Therefore, more sophisticated cooling techniques are required. … [Read more...]
Thermal Conductivity of Doped, Porous and Isotopically Pure Silicon
Earlier issues of ElectronicsCooling showed the thermal conductivity for pure Si (May '98), SiO2 (Aug '04) and III-V semiconductors (Feb '06). This column focuses on doped Si, porous Si and isotopically pure Si. Table 1. Thermal Conductivity Data at Room Temperature The first seven rows of Table 1 show thermal conductivity data for natural and isotopically pure Si as … [Read more...]
A Simple Thermal Resistance Model – Isoflux Versus Isothermal
In most cases today thermal design for electronic products is performed with the aid of sophisticated computational fluid dynamics and heat transfer codes. Nonetheless, there may still be occasions when a thermal designer needs a quick estimate of the external thermal resistance of a package or heat sink that does not warrant the use of powerful computer codes. In such cases an … [Read more...]
Indirect Thermosyphons For Cooling Electronic Devices
Nomenclature Variables R Thermal Resistance [°C/W] or [°C-mm2/W] Q Power [W] Q" Heat Flux [W/cm2] T Temperature [°C] or [K] h Heat Transfer Coefficient [W/cm2-K] Subscripts sat saturation tc thermocouple s sink or boiler w wall j junction layer of die a ambient f fluid or saturation c chip surface boil associated with … [Read more...]
- « Previous Page
- 1
- …
- 79
- 80
- 81
- 82
- 83
- …
- 127
- Next Page »
