Introduction In the past 15 years, we have observed a significant increase in the use of Computational Fluid Dynamics (CFD) codes to calculate the thermal behavior of electronic systems. The benefits are undisputed when it comes to performing parametric studies in early design phases. However, when the objective is accuracy, the discussion about what we can expect in practice … [Read more...]
Design of Experiments for Numerical Parameter Studies of Electronic Systems: Optimizing the Cooling Strategy of an Ethernet Switch
Introduction As electronic products become more sophisticated and design margins tighten, defining the thermal management strategy early in the design cycle is vital to ensure a cost-effective design for the level of heat dissipation. Optimizing the cooling system for an electronic product can involve juggling many design parameters, such as airflow rate, fan and vent … [Read more...]
Phase Change Material Thermal Properties
Table 1. General Solid-Liquid PCM Characteristics [1] When electronics are operated under transient conditions, increasing the thermal capacitance is a useful technique for limiting temperature increases and/or minimizing the performance requirements of a heat sink. One effective method of increasing thermal capacitance is to include a material that undergoes a change of … [Read more...]
Review of Low Profile Cold Plate Technology for High Density Servers
Introduction Water cooling of computers was introduced more than twenty years ago, but had disappeared from the mainstream by the mid 1990s. The conversion of chip technology from bipolar to CMOS (complementary metal oxide semiconductor) was the main reason. As chip powers continue to increase, water cooling appears likely to become mainstream again. In the current market, the … [Read more...]
Using an Equivalent Heat Transfer Coefficient to Model Fins on a Fin
Many readers of ElectronicsCooling are probably familiar with the use of fin efficiency formulas to estimate the thermal resistance of the commonly used parallel plate fin heat sink. Given the heat transfer coefficient, h, acting on a fin and the dimensions of the fin, the thermal resistance of an individual fin is given by: where Af and η are the surface area and … [Read more...]
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