Warpage of FC-PBGA Packages Flip chip technology has emerged as an important chip-level package solution to meet the ever-increasing demand of high I/O requirements. The flip chip technology was implemented originally for a multi-layer ceramic substrate. In the ceramic flip chip package, a shear strain in each bump, produced by the mismatch of the coefficient of thermal … [Read more...]
Packaging And Temperature Control Considerations For Planar Waveguide Circuits
Optical Networking The all-optical network has been emerging as a solution to provide higher bandwidth, lower cost systems for handling high capacity network traffic. Due to the inherent limits of copper wire and the high cost-per-bit of electrical systems, service providers will replace electrical components with fiber optic counterparts wherever possible as the cost of the … [Read more...]
Power Density Challenges Of Next Generation Telecommunication Networks
Despite the current downturn in the telecommunications industry, data transfer (i.e. network traffic) is continuing to grow at a 100% rate [1]. It is already projected that network traffic demand will reach tens of Tb/s in a couple of years from now (see predicted traffic demands from telecommunications analysts Ryan, Hankin & Kent, Figure 1). At the same time, network … [Read more...]
Electronic Information Exchange
Electronic data exchange represents a very important link for integrating PCB electrical layout, analysis and mechanical design. It has become, in fact, the basis for enhanced economic and industrial growth. The Intermediate Data Format (IDF) is the most used file format for exchanging printed circuit assembly (PCA) data between electrical and mechanical CAD/CAE systems and for … [Read more...]
Electroosmotic Microchannel Cooling System for Microprocessors
Computer heat sinks, such as fin arrays and heat pipes, are much larger than silicon chips and are continuing to grow in size. This trend is driven by the increasing chip heat generation rates and has serious implications for overall system performance. The large volume of existing heat sinks causes discrete memory, video, and power-delivery components to be crowded away from … [Read more...]
- « Previous Page
- 1
- …
- 93
- 94
- 95
- 96
- 97
- …
- 126
- Next Page »
