What information does light, reflected from a running electronic device, carry? Our research team has been working upon this key question for almost a decade. As this magazine is dedicated to thermal issues, we will focus upon these aspects of optical probing. Figure 1 shows the general principle of our experimental method. Light is shone upon a running device. When the device … [Read more...]
Pyrolytic graphite – thermal performance by structure
Continuing our discussion of different forms of carbon, this column addresses the topic of pyrolytic graphite, a material that opens up many interesting applications not only for cooling but also for scientific measurement equipment. Pyrolytic graphite - the finest forms of which are often called Highly Ordered Pyrolytic Graphite (HOPG) - is manufactured through a pyrolysis … [Read more...]
Quick and easy fan/sink characterization
It is often necessary to generate in-house pressure-drop and base-to-ambient thermal resistance data for ducted fan/heat sink assemblies. For reliable applicability of the performance data, the configuration of the test article should closely match the intended application so that the test article coolant flow characteristics (turbulence level, 3-dimensionality, etc.) match … [Read more...]
Dynamic Measurements: A Cornerstone of the European PROFIT Project
This article presents an overview of a number of dynamic measurement methods as part of the European PROFIT project. Due to lack of space, details cannot be given, but the interested reader is invited to consult the references at the end of the article. Because the majority of a product's cost and performance are committed in the early phases of a design cycle, it is envisioned … [Read more...]
Dynamic Temperature Measurements: Tools Providing a Look into Package and Mount Structures
Today it is commonly accepted that dynamic thermal measurements, which have been used for more than 20 years [1], [2], [3], [4], are superior to steady-state ones. The temperature vs. time function - often called the thermal step-response function, heating curve, or thermal impedance curve - is characteristic of the chip-to-ambient structure, including even different cooling … [Read more...]
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