As most readers are no doubt aware, the trend towards ever increasing processor module power is making it more and more difficult to cool directly with air. Many thermal engineers are convinced that water cooling may be the answer. This does not necessarily mean that cooling water must be supplied by the customer. Instead, in some instances it may be possible to use a … [Read more...]
Flash Diffusivity Method: A Survey of Capabilities
The development, specification, and quality control of materials used in electronics packaging and thermal management often require the measurement of thermophysical properties.This data can be critical to a successful design, especially with the rapidly increasing cooling requirements that result from the packaging of higher performance devices. A variety of methods, involving … [Read more...]
Thermal Design Challenges in Automotive Alternator Power Electronics
Ever since the advent of the automotive alternator, or claw-pole alternating current generator, in the 1960's, there has been an ever-increasing thermal design challenge to cool the power electronics in these machines. Figure 1 depicts a typical cutaway section of a modern day alternator. At first glance one may think that cooling the diodes in a rectifier bridge of an … [Read more...]
Understanding Phase Change Materials
Although phase change materials (PCM) were introduced nearly twenty years ago, it was not until the development of the high-powered Pentium processor that this class of interface material gained widespread acceptance. The large quantities of heat produced by these processors necessitated a carefully designed thermal path where all of the thermal resistances were minimized. For … [Read more...]
Advanced Techniques for IC Surface Temperature Measurement
Introduction: The Need for IC Surface Measurement Techniques Current trends in microelectronic design generate challenges in both the design and test of integrated circuits (ICs). One area that has been gaining increased relevance with regard to the microelectronic evolution is thermal management/analysis, which proves essential in the domain of IC design to prevent reliability … [Read more...]
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