FloTHERM's strength has always its been its robustness, founded on a simplicity of technology that we've tried not to compromise over its 25 year life. This is no truer than in its 3D CAD drawing interface. More Lego than Sculpting in its capabilities, it's always been quick and easy to mock up a conceptual cooling architecture for a proposed design. FloTHERM V10 provides a … [Read more...]

Temperature has always been, and will continue to be, a good enough leading indicator of product reliability. As a parameter it is easy to specify a maximum rating value and relatively easy to measure. However it is not temperature itself that directly causes product failure, more often than not it is some kind of mechanical fracture or deformation that itself is fuelled by … [Read more...]

The first deadline for abstract submissions to the 20th IEEE Workshop on THERMAL INVESTIGATIONS OF IC’s AND SYSTEMS (THERMINIC 2014) to be held at the magnificent World Heritage Site in Greenwich, London, has now passed. We’ve had a great response to the first call for abstracts, with more abstracts submitted this year compared to last year. The quality of abstracts submitted … [Read more...]

Electronic products, and products that contain electronics, are typified by being constructed of 100s if not 1000s of individual parts. A CPU alone is the most complex manufactured product on earth as demonstrated in this excellent picture story on Tom’s Hardware. From the IC through package, PCB and chassis, items are glued, cured, soldered, screwed and assembled into … [Read more...]

FloTHERM V10 is a major release that marks 25 years as the leading electronics thermal simulation tool. This series will introduce the top 10 features that we’ve delivered, hopefully giving some insights not just on the features themselves, but also on the background as to how and why we’ve developed them. To start with let’s look at the most obvious change, a … [Read more...]