The following transcript and video were originally presented at Thermal LIVE 2015 by George Meyer. For access and information on all Thermal LIVE events, both past and present, please visit https://thermal.live/. https://www.youtube.com/watch?v=DjTz7yzRY2s&t=1s Graham Kilshaw: Hello and welcome to Thermal LIVE 2015. This presentation is A Practical Guide to … [Read more...]
Everything You Need to Know About PCB Box Build Services is Here!
The world is going with a technical advancement, where electronic items are getting advanced with time. The PCB box build assembly uses multiple circuits on a single track, which takes less space on the board. PCB box build has another terminology that people usually use, which is system integration. The PCB box build process depends on multiple projects, which have variations … [Read more...]
Heat-Blocking Defects Detected Acoustically
In the landing gear control module of an aircraft, a high-voltage IGBT is about to fail. In the solder bonding one chip’s ceramic base to its heat sink are three small air bubbles—voids, in the vocabulary of electronic failures. The three voids are close together, and the largest is almost directly under a hot spot on the die. Collectively the voids have diminished … [Read more...]
Thermally Conductive Epoxy for Large Potting Applications Features Low Exotherm
Product: EP29LPAOHT Master Bond EP29LPAOHT is a two-component, NASA low outgassing approved epoxy system featuring a long working life of 8-10 hours per 1,000 gram batch. Due to its low exotherm and flowable consistency, this product is suitable for specialty potting applications where large masses of the epoxy need to be cured. It can be mixed and poured in … [Read more...]
Two-Component Room Temperature Curing Thermally Conductive And Electrically Insulating Adhesive
Ayer, MA, August 2020 New Product – Creative Materials introduces 813-76, a two-component room temperature curing thermally conductive and electrically insulating adhesive. This product is designed for assembling heat-sensitive components on printed circuit boards, and it develops strong adhesive bonds and excellent thermal transfer. 813-76 provides high impact bonds … [Read more...]
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