Over the last 50 years, the automotive industry has been going through huge shifts in electrification (Figure 1). And, of course, we are seeing the electric motor starting to replace the mechanical engine with the advent of Electric & Hybrid vehicles. Not surprisingly, the demand for ever higher density in a confined electronics leads to a greater and greater need to … [Read more...]
What is the Right Temperature Set Point for My Electrical Enclosure?
Cooling units are necessary for hot enclosures, but selecting the proper temperature set point for yours can mean the difference between failure and enhanced performance Electrical enclosures serve to protect electrical devices from adverse environmental influences, such as dirt, other particulates, moisture, or chemicals that could damage components. What is more, by … [Read more...]
Towards Green Technology: Modeling of a Compact Plate Heat Exchanger Condenser for Thermosyphon Cooling of Entire High Power Datacenter Racks
By Raffaele Luca Amalfi, Ph.D., Jackson Braz Marcinichen, and John Richard Thome, Ph.D. CONTEXT AND NEW COOLING TECHNOLOGY Heat dissipations of servers and their racks in datacenters are reaching ever increasing levels, breaching the economical heat removal limits of traditional air-based cooling technologies. Currently, about 40% to 45% of the total datacenter energy … [Read more...]
Thermal Facts & Fairy Tales: Whatever Happened to the Predicted Data Center Energy Consumption Apocalypse?
As the title indicates, since the middle of the last decade, there have been very pessimistic projections regarding the growth of the total annual energy used by data centers in the U.S. One of them suggested that by 2030, the energy consumption in the U.S. in the IT sector would be roughly 60% of that used by its entire industrial sector. [1,2,3] What was the origin of this … [Read more...]
Using Electrical Capacitance to Evaluate the Thermal Mechanical Stability of Thermal Interface Materials
BY: Lauren Boston, Andrew Yu, Timothy Chainer, Edward Yarmchuk, and Michael Gayness To improve cooling of electronic components, a heat spreader is typically attached to the component to spread the heat laterally and facilitate the heat removal by a heat sink. To ensure good thermal conduction between the heat spreader and heatsink, a thermal interface material is applied … [Read more...]
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