The 35th Semiconductor Thermal Management conference starts in a week and is being held in Silicon Valley, CA. Electronics Cooling is one of the media sponsors and will have an exhibit booth –stop by to say hello, pick up some literature and chat with us to learn more about what is “hot” in the electronics industry and how it is so “cool” to work on thermal management! … [Read more...]
Some New Cooling Ideas are Needed Here
In the 1920s, the field of physics was in disarray. The reason was that many careful observations and experimental data could only be explained by conflicting theories; for example, some proved that light was a wave, while others provided it had a particle-like nature. Other experiments, such as those in black-body radiation or the photoelectric effect, could not be explained … [Read more...]
Thermal Management of Electronic Equipment using Phase Change Materials (PCMs)
Background The cooling of electronics and telecom equipment is essential to the proper operation of all applications. Removal of generated heat from these systems has been traditionally carried out via heat conduction/convection techniques. Phase Change Materials (PCMs) are a relatively new concept for the cooling of electronic systems. A PCM is used to absorb peak energy … [Read more...]
Using Wide Bandgap Materials in Power Electronics Presents a New Set of Thermal Challenges
The power electronics industry has reached the theoretical limits of silicon and now is moving to other semiconductor materials whose performance meets the requirements of today’s high power density systems. A number of techniques are being used to overcome the thermal limitations of power modules. One approach is using semiconductor materials which are able to bypass Si’s … [Read more...]
You’re Sending That Heat “Away” to Where, Exactly?
Engineers are generally hard-nosed realists and don’t rely on the mythical kingdoms of fairy tales where only good things can happen and all problems disappear. Still, there is one magical place which is often called out when dealing with the thermal aspects of design, and it has the simple name of “away.” How so? Cooling devices and techniques – including heat sinks, heat … [Read more...]
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