by: Pritish R. Parida, Mark Schultz & Timothy Chainer J. Watson Research Center, Yorktown Heights NY, USA INTRODUCTION In the Moore’s Law race to keep improving computer performance, the IT industry has turned upward, stacking chips like nano-sized 3D skyscrapers. But those stacks, like the law they’re challenging, have their limits, due to overheating. A solution … [Read more...]
SEMI-THERM 34: The Most Comprehensive Symposium Addressing Thermal Challenges of Consumer Design, Electronics Components, and Data Centers to Take Place March 19-23, 2018
THE 34TH ANNUAL CONFERENCE AND EXHIBITION WILL BRING TOGETHER LEADING INDUSTRY EXPERTS IN SAN JOSE, CA TO SHARE IDEAS THAT WILL SHAPE FUTURE TECHNOLOGIES San Jose, CA, USA – March 08, 2018: The SEMI-THERM Educational Foundation (STEF) proudly announces that the 34th Annual Thermal Measurement, Modeling and Management Symposium will take place from Monday, March 19th to … [Read more...]
New Synthetic Dielectric Coolants Deviate From Traditional Petroleum-based Dielectric Oils
Image Caption: A capacitor failure on a GPU board was caused from oil absorption through the capacitor’s rubber seats while emerged in white oil. As higher clock frequencies and smaller transistor dimensions continue to increase the power density of high-performance computing technologies, such as CPUs, GPUs, FPGAs, Laser Diodes, and Optical electronics, advances in thermal … [Read more...]
Join the Electronics Cooling Community of Authors and Bloggers!
Electronics Cooling invites you to share your expertise, knowledge, and perspective on critical aspects, foundational education, and trends with electronics thermal management technology. Electronics Cooling stands strong as one of the foremost resources for thermal management engineers and professionals, and much of this success is the result of a dedicated community of … [Read more...]
Estimating Internal Air Cooling Temperature Reduction in a Closed Box Utilizing Thermoelectrically Enhanced Heat Rejection
An earlier article in this column considered the problem of cooling electronic components in a closed box [1]. In outdoor applications for example, it may be necessary to totally seal the box to prevent exposure to airborne particulates, water droplets or other sub- stances in the air that could be injurious to the electronic components. In such an application, heat picked up … [Read more...]
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