Coauthored by: Ross Wilcoxon, Mark Dimke, Chenggang Xie Rockwell Collins INTRODUCTION Die attach can play a significant role in the package level thermal resistance of wire bonded devices. Die with moderate heat flux can often be attached to the carrier substrate with organic, Silver Filled Die Attach (SFDA) materials that require relatively benign processing requirements … [Read more...]
Does a 10°C Increase in Temperature Really Reduce the Life of Electronics by Half?
This may seem like a silly question to ask in a magazine entitled “Electronics Cooling”, but why do we really care what temperature of electronics really is, anyway? The simple answer to that question is that it is universally recognized that electronics reliability when devices are too hot for too long of a time. The difficult answers to the question are in defining exactly … [Read more...]
Simulation Driven Design Optimization for Reduction of Temperature on a High Current Density PCB
Co-authored by: Nitesh Kumar Sardana, Susyamala Pavan Kumar Busam, Dr. Laxmidhar Biswal Robert Bosch Engineering and Business Solution Pvt. Ltd. Abstract The market demand for lightweight and cost effective electronic products with multi-functional operations leads to the introduction of plastic housing and high current density on board. In general, automotive electronic … [Read more...]
How Vapor-Compression Cooling Works
Vapor-compression cooling can be found in virtually any home, such as in air conditioners that remove heat from our homes and in refrigerators that store our food. The history of vapor-compression goes back to 1805 where Oliver Evans, an American inventor, described a closed vapor-compression refrigeration cycle for producing ice. The first working vapor-compression … [Read more...]
Advanced Cooling for Power Electronics
Power electronics devices such as MOSFETs, GTOs, IGBTs, IGCTs etc. are now widely used to efficiently deliver electrical power in home electronics, industrial drives, telecommunication, transport, electric grid and numerous other applications. This paper discusses cooling technologies that have evolved in step to remove increasing levels of heat dissipation and manage junction … [Read more...]
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