TEM Products Inc., a manufacturer of mechanical components for electro-mechanical assembly, has released its new patent-pending PowerPeg thermal connectors. Designed for attachment to an external dissipater, the new PowerPeg thermal connectors offer significantly improved thermal conductivity compared to traditional PCB heat spreading methods by allowing heat to dissipate more … [Read more...]
Heat Pipe Integration Strategies for LED Applications
Dr. Richard Bonner, Anqi (Angie) Fan, Daniel Pounds and Dr. Ehsan Yakhshi-Tafti; Advanced Cooling Technologies, Inc. INTRODUCTION In light-emitting diodes (LEDs), 70 percent to 80 percent of the applied electrical power is converted to waste heat. If this thermal energy is not properly dissipated, the resulting high operating temperatures lead to reduced brightness, shift … [Read more...]
NASA Selects Proposals for Future Spacecraft Thermal Control Systems
NASA has selected eight proposals to develop advanced thermal control system technologies for future spacecraft as part of its Game Changing Development Program (GCD). The program was created to investigate novel ideals and approaches to protect spacecraft and the astronauts within while enabling them to remain in space for longer periods of time. The selected proposals will … [Read more...]
Heat Exchanger Research Could Lead to Better Liquid Cooling in Aerospace, Automotive, Defense Applications
A New Mexico State University assistant professor is investigating methods of increasing heat exchanger efficiency that could enable space missions to remain in orbit for longer periods of time and lead to better automotive, defense, data center and power generation thermal management systems. “The problem we are addressing is how to extend NASA space missions,” Krishna Kota, … [Read more...]
Embedded Heat Pipe Technology for Heat Removal in Military Applications
Researchers at Advanced Cooling Technologies Inc. have developed a new cooling technique for high-power VPX embedded computing cards that utilizes embedded heat pipes to increase heat removal for computer boards. The new Dual-Sided Condenser technology is ideal for military embedded computing applications, including radar signal processing, avionics electronics boxes and RF and … [Read more...]
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