(June 3, 2016) Because electronics have shrunk significantly in recent years, the solutions to cool them must be adjusted. Electropages.com suggests “a case-specific analysis must be performed as each application is subject to different circumstances,” to determine the right strategy for cooling electronics. This analysis is called “CFD analysis,” or computational fluid … [Read more...]
New Skived-Copper Fan Heat-sink Keeps Intel Servers Cool
JARO has recently released their new low-profile, 1U CPU cooler with a heat-sink and blower, model JCC00066. Specifically designed for use with data storage, high-density, backup, or cloud servers, JARO’s cooler works well for Intel processors that interact with square socket (2011) types. The high-quality coolers come in two sizes, one of which provides a narrow heat-sink … [Read more...]
New Market Entry of Sealed Enclosure Coolers
As their “first step” into the sealed enclosure cooling market, Advanced Cooling Technologies (ACT) has recently launched its HSC, HPC and LNC series of sealed enclosure cooler products. ACT said this about each of their new products: “ACT’s HSC series of coolers are based on a patent pending design that utilizes the air impingement technology that is thermally efficient and … [Read more...]
Diamonds May Take Silicon’s Place in Future Smartphones
A startup called Akhan Semi suggests lab-grown diamonds can cool electronics more efficiently than silicon. Silicon costs a lot to keep cool, but lab-grown diamonds could eliminate cooling fans and heat sinks since they already eliminate 90% of the energy lost by silicon, according to Adam Khan, founder and CEO of Akhan Semi, the diamond-making startup. “Because a … [Read more...]
New TIMs That Offer High Thermal Conductivity
Chomerics Europe, a division of Parker Hannifin, has recently revealed a new thermal interface material with high thermal conductivity and very low deflection force designed for effective heat dissipation in telecommunication, IT, and automotive applications, THERM-A-GAPTPS60. “THERM-A-GAP TPS60 comprises a soft (Shore 00-35) silicone matrix filled with thermally conductive … [Read more...]
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