In a recent blog post, Robert Smith discusses heat sink optimization through the use of pin fins. “Local heat transfer coefficients are highest when the air first begins to form a boundary layer. The benefit to lots of pins is that you force the boundary layers to break away often and re-create on the next pin,” Smith said. The heat sink forms a 3D mesh of pins that cross … [Read more...]
Thermal Invisibility Cloak Improves Heat Distribution in Electronics
A team of researchers from the Nanyang Technological University (NTU) in Singapore has developed a thermal invisibility cloak that would improve heat distribution in electronic devices by redirecting incoming heat. The cloaks are capable of guiding heat around a hidden object, thus resulting in complete thermal invisibility. “Based on carefully engineered metamaterials – … [Read more...]
Interactive 3D Thermal Heatsink Modeling Simulation Software
Yesterday, during the 2015 IEEE ECCE conference and exposition in Montréal, Canada, Mersen presented the R-Tools GEN III. Mersen will show the redesigned interactive 3D Thermal Heatsink Modeling simulation software today, Sept. 22, as well. “R-Tools Gen III is a free on-line simulation software that allows users to model the optimum air cooled heatsink solution tailored to … [Read more...]
An Additive Design Methodology for Heatsink Geometry Topology Identification
Introduction Established heatsink manufacturing processes such as extrusion, casting and milling constrain the achievable topology and geometry of the heatsink. The advent of metallic 3D printing (additive manufacture) processes such as selective laser melting (SLM) may remove many of these constraints, forcing the designer to reconsider the approach taken to determine a … [Read more...]
Comparison of HPC and Telecom Data Center Cooling Methods by Operating and Capital Expense Extended Article
Dr. Alexander Yatskov Thermal Form & Function Inc. Introduction Current high-performance computing (HPC) and Telecom trends have shown that the number of transistors per chip has continued to grow in recent years, and data center cabinets have already surpassed 30 kW per cabinet (or 40.4 kW/m2) [1]. It is not an unreasonable assumption to expect that, in accordance … [Read more...]
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