Tglobal Technology Co., Ltd. has released its new PC94 non-silicone thermally conductive pad. Ideal for electronic component, heat sink, LED and other thermal applications, the new soft pad features an acryl base, natural tack and good insulation with a thermal conductivity of 4 W/m-K, working temperature of -40°C to 105°C and tensile strength of 2 Kgf/mm2. … [Read more...]
Use of JEDEC Thermal Metrics in Calculating Chip Temperatures in Packages with Attached Heat Sinks
Bruce Guenin Associate Technical Editor, Electronics Cooling INTRODUCTION The previous column, "Use of JEDEC Thermal Metrics in Calculating Chip Temperatures (without Attached Heat Sinks)" dealt with the application of JEDEC thermal metrics to IC packages that do not have heat sinks attached to them [1]. The methods are applicable to prediction of the junction … [Read more...]
Heat Sink Series Provides Modular Cooling Options for Electrical Components
Ohmite Manufacturing, a provider of thermal solutions and resistors, has released its new B60/C60 heat sink system ideal for use with high power density and small size (3U or 4U) electronic packaging with forced convection. The new B60/C60 heat sink system provides designers with a variety of cooling options for up to six TO-246 or TO-264 devices, such as TO-247 and TO-264 … [Read more...]
Fansinks for High Temperature Applications
CTS Corporation has announced the release of new fansinks for high temperature applications. Designed to absorb and disperse heat away from high temperature devices, the FHS series features an operating temperature range of -10°C to 90°C, calculated MTTF @ 90°C: 86,858 hours (GEM, 90% confidence) and various package sizes to fit different applications. The FHS series is … [Read more...]
Carbon Nanotubes Boost Microprocessor Cooling
Researchers from the U.S. Department of Energy have developed a new technique that combines carbon nanotubes and organic materials to enable more efficient cooling of microprocessor chips. While carbon nanotubes have long been known to offer high thermal conductivity, widespread application in cooling systems has proven difficult because of their high thermal interface … [Read more...]
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