A new report finds that the market for light-emitting diodes (LEDs) is set to grow substantially in the next 10 years, surpassing even compact fluorescent lightbulbs as an energy-efficient lighting option. By 2020, LEDs will cover 46 percent of the $4.4 billion U.S. market for lamps in the commercial, industrial and outdoor stationary sectors, driven by the overall push toward … [Read more...]
Thermally Conductive Printed Circuit Board Substrate
Laird Technologies, Inc. recently announced the release of its enhanced Tlam™ SS LLD for use as a thermally conductive printed circuit board (PCB) substrate. The Tlam SS LLD is a versatile, thermally enhanced PCB substrate system specifically designed for heat dissipation in bright and ultra-bright LED module applications. The thermally conductive PCB substrate provides 8-10 … [Read more...]
On The Challenges of Thermal Characterization of High-Power, High-Brightness LED Packages
Introduction In recent years, high-power, high-brightness Light Emitting Diodes (LEDs) have penetrated into an ever-increasing number of lighting applications. For such devices, maintaining a low die temperature is becoming a huge challenge because of the escalating power density (e.g., 200-300 W/cm2 for the latest generation). Active cooling solutions are rarely considered as … [Read more...]
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