Fairchild Controls Corporation, an EADS North America company, has signed a teaming agreement with the U.S. Air Force Research Laboratory (AFRL) to evaluate innovative cooling system technologies for avionics and mission systems aboard military aircraft. The Cooperative Research and Development Agreement (CRADA) will result in the joint development and operation of a … [Read more...]
3D chip stacking to take Moore’s Law past 2020, pose new chip cooling challenges
A team of IBM Researchers in collaboration with two Swiss partners are looking to keep “Moore’s Law” alive for another 15 years. The law states that the number of transistors that can be placed inexpensively on an integrated circuit will double every 18 months. More than 50 years old, this law is still in effect, but to extend it as long as 2020 will require a change from mere … [Read more...]
Department of Energy announces $100 million for innovative research projects
At the inaugural ARPA-E Energy Innovation Summit, U.S. Energy Secretary Steven Chu announced $100 million in Recovery Act funding will be made available to accelerate innovation in green technology, increase America’s competitiveness and create new jobs. Of the three technology focus areas destined to receive funding, one of interest to ElectronicsCooling readers involves … [Read more...]
International Conference on High Temperature Electronics (HiTEC 2010)
May 11-13, Hyatt Regency, Albuquerque, N.M. HiTEC 2010 provides a comprehensive technical program addressing the applications, and the latest development in devices, circuits, MEMS, sensors, packaging, power sources, and materials to address the challenges of the applications for high temperature electronics. Learn more. … [Read more...]
Handbook Provides Tutorial for Thermoelectric Module Operation
Laird Technologies, Inc. has released its revised “Thermoelectric Handbook.” Available for download from the Laird website, the handbook provides insight into understanding the basic structure and function of TEMs, parameters required for device selection, assembly tips for mounting TEMs onto heat exchangers, and available temperature control options. Designed for engineers … [Read more...]
