Thermal Design Power (TDP) is a term commonly used in the thermal management of consumer electronics. While the usage of this terminology may vary across the industry, it commonly refers to the amount of power that a device may dissipate indefinitely, in a given thermal environment, without exceeding the temperature limits of the device. The TDP for a consumer electronics … [Read more...]
Summary of the IEEE ITherm 2022 Conference
The IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) was held at the Sheraton Hotel & Marina in San Diego, CA, May 31 – June 3, 2022. This was the 21st ITherm, which was first held in 1988. The conference was historically held every other year until 2016 when it switched to an annual schedule. ITherm 2022 was sponsored by … [Read more...]
Statistics Corner: Probability
Statistical analysis is needed because data always have some degree of uncertainty; a value that we determine from a single measurement, or even set of measurements, is not necessarily going to tell us exactly what value we will determine with additional measurements. Statistical analysis uses the mathematics of probability to create tools that we can use to deal with … [Read more...]
Digital Edge Specifies Nortek’s StatePoint® Liquid Cooling Technology for Upcoming Philippines Data Center
Digital Edge to achieve Power Usage Effectiveness and Water Usage Effectiveness sustainability goals with StatePoint® Oklahoma City, (May 17, 2022)—Digital Edge (Singapore) Holdings Pte. Ltd., (“Digital Edge”), a leading Asian data center developer and operator, leverages StatePoint® liquid cooling technology manufactured by Nortek Data Center Cooling™, Oklahoma City, for … [Read more...]
Arieca Announces $6.5M Series A Funding Round
Company will use the investment to accelerate product development and scale up manufacturing of its Liquid Metal-based thermal interface materials (TIMs). May 17, 2022 8:00 AM Eastern Daylight Time PITTSBURGH--(BUSINESS WIRE)--Arieca Inc., the leader in liquid-metal based thermal interface materials for high performance computing and high power semiconductor devices, … [Read more...]
- « Previous Page
- 1
- …
- 3
- 4
- 5
- 6
- 7
- …
- 164
- Next Page »
