Advanced Thermal Solutions, Inc. (ATS) now provides fanSINKS™ heat sinks for component sizes ranging from 27mm to 70mm square. The wider size range accommodates hot semiconductor components, including FPGAs, ASICS and other package types used in telecomm, optics, test/measurement, military and other applications. ATS fanSINKS™ feature cross-cut, straight aluminum fins. They … [Read more...]
A Polyimide Single-Component Silver Filled, Electrically Conductive Semiconductor Die-Attach Adhesive
Creative Materials introduces 122-47, a polyimide single-component silver filled, electrically conductive semiconductor die-attach adhesive. This product can be applied by stamping, screen printing, dipping and syringe dispensing, and is designed for die-attachment and surface mount applications. Other applications include assembling electrical and electronic components. The … [Read more...]
Laird Thermal Systems Offers Online Thermoelectric Modeling Tool for PCR Design Engineers
The Thermal Wizard helps engineers simulate PowerCycling PCX Thermoelectric Coolers in PCR applications… Laird Thermal Systems, the world leader in thermal management solutions has launched an online simulation tool for PCR thermal cycling applications. Thermoelectric coolers designed for thermal cycling, such as the PowerCycling PCX Series, are used for Real-Time PCR to … [Read more...]
Orion Reversible Flow Fans Feature Directional Flow and Speed Control in One Unit
Reversible flow fans segment the PWM duty cycle curve, extending the control paradigm … August 24, 2021 (Dallas, TX) Orion Fans has launched a series of microcontroller-based, up to IP68-rated, reversible flow fans. By utilizing PWM signals to control fan speed, the fans provide engineers an innovative solution to some of their most challenging cooling … [Read more...]
PTAB Determines All Challenged Claims of Two Asetek Patents Asserted Against CoolIT Are Unpatentable
Calgary, Alberta. August 2021 – CoolIT Systems Inc. (“CoolIT”), the global leader in scalable liquid cooling technology for desktop and data centers systems, announces that on August 19, 2021, under 35 U.S.C. § 318, the U.S. Patent and Trademark Office’s Patent Trial and Appeal Board (“PTAB”) issued two Final Written Decisions determining that all challenged claims of U.S. … [Read more...]
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