In recent years, scientists have developed the ability to manipulate light around an object through the use of man-made “metamaterials,” rendering the object seemingly invisible. Now, researchers from the Karlsruhe Institute of Technology (KIT) in Germany have demonstrated the similar ability to manipulate the flow of heat across a sheet of metal to hide a defect in the … [Read more...]
Astronauts Fix Ammonia Coolant Leak on International Space Station
UPDATE May 13, 2013: Expedition 35 Flight Engineers Chris Cassidy and Tom Marshburn completed a five-hour spacewalk on Saturday to replace a pump controller box on the International Space Station’s far port truss, NASA officials reported Sunday. Long-term monitoring of the replacement pump will be required to determine whether the issue has been fixed. May 10, 2013: Astronauts … [Read more...]
New Business Development Specialist Seeks Position
Technical Sales Professional with proven record establishing profitable new business for “special” electrical, electronic and EMI/RFI components. Successful history includes working directly with Engineering/Procurement at OEM’s including DRS Technologies, Boeing and Matsushita. Experienced in Field Sales, Sales Training and Sales Management positions, seeking CHICAGO-based … [Read more...]
'Advanced Composite Thermal Management Materials and Applications' Webinar to Take Place
Electronics Cooling will host its next webinar, "Advanced Composite Thermal Management Materials and Applications" on June 26, 2013. Abstract Thermal management is a key problem for aerospace/defense, commercial and consumer electronic and photonic (e.g. laser and LED) systems. Advanced thermal management materials are critical for meeting many system requirements. A … [Read more...]
Preventing Thermal & Vibration Failures in Electronic Equipment
May 22, 2013 Online Presented by Steve Carlson, a Mechanical Engineer Analyst at Northrop Grumman Navigation Systems Division in Woodland Hills, Calif., this webinar will focus on three topics: how variations in coefficients of thermal expansion (CTE) can affect the magnitude of the displacements, forces, and stresses that are developed in electronic assemblies during … [Read more...]
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