As data-center rack densities climb and AI/HPC workloads expand, cooling infrastructure must evolve. Traditional approaches face growing limitations in capacity, scalability, efficiency and footprint. The Airsys PowerOne platform addresses these challenges through a modular, multi-medium cooling architecture engineered for modern compute environments. Technical Highlights … [Read more...]
Direct-Die Liquid Cooling: A Scalable Approach for Power Module Thermal Integration
Abstract This paper presents a novel thermal management approach for power semiconductor modules by integrating active liquid cooling directly into the substrate. Utilizing Direct Bond Copper (DBC) structures embedded within liquid cold plates, the method minimizes thermal interfaces, improves power density, and ensures better reliability. It contrasts traditional … [Read more...]
Simulation of Two-Phase Microchannel Heat Sink Performance: Refrigerant, Inlet Conditions, and Hot Spots Effects
Introduction The introduction of large language models (LLM), such as ChatGPT, has made artificial intelligence highly accessible. One of the key driving forces behind this growth has been the advancement in the processing power of compute devices such as central processing units (CPUs) and graphics processing units (GPUs). An increase in this processing power is … [Read more...]
Gates Strengthens Data Center Portfolio with Launch of Data Master™ Eco
Gates Corporation, a global manufacturer of innovative, highly engineered power transmission and fluid power solutions, has launched Data Master™ Eco. This next-generation liquid cooling solution is designed to support hyperscale data centers and high-performance computing (HPC) conditions to maximize uptime, reduce environmental impact and meet the complex AI-enabling, data … [Read more...]
Alloy Enterprises Extends Direct Liquid Cooling Across the Blade, Eliminating the 100 kW Peripheral Heat Bottleneck
Boston, MA – November 5, 2025 – Alloy Enterprises today announced a breakthrough in data center cooling: single-piece, leak-tight cold plates that extend direct liquid cooling (DLC) across the blade, including DIMMs, NICs, and QSFPs. Built using the company’s patented Stack Forging™ process, the new design enables full-blade liquid cooling for the first time, eliminating the … [Read more...]
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