Colder Products Company, a provider of quick disconnect couplings and fittings for plastic tubing, has released the new LQ6 series connectors. Designed specifically for liquid cooling applications requiring multiple connect and disconnect cycles, these specialized couplings deliver reliability, security and ease-of-use in cooling applications where a drip-free connection is … [Read more...]
New Surfaces Ease Dissipation of Extreme Heat
A new method of cooling extremely hot surfaces more effectively from researchers at MIT could benefit industrial equipment and electronic devices. Considered by many to be a quieter, more efficient way of removing heat compared to traditional air cooling methods, liquid cooling is commonly used in a number of applications such as internal combustion engines in vehicles and … [Read more...]
Waterproof Tablet Computer Features Cooling Fan
Electronics manufacturer Fujitsu has released a unique new tablet computer capable of operating underwater while using a cooling fan to pump heat away from sensitive internal circuitry. The Arrows Tab QH77/M is 2-in-1 computer that can be used both as a clamshell notebook computer and as a tablet computer when the display unit is detached. The casing houses an Intel Core … [Read more...]
‘Electronic Blood’ Powers and Cools Brain-Inspired Computer
IBM has unveiled a prototype of a new brain-inspired computer powered and cooled by what the company is calling “electronic blood.” The company says it is learning from nature in an effort to develop small, highly efficient computing systems. "We want to fit a supercomputer inside a sugar cube," IBM researcher Bruno Michel, Ph.D., told the BBC. He and co-researcher Patrich … [Read more...]
Patent Covers Methods of Making, Cooling Semiconductor Packages
The U.S. Patent and Trademark Office has awarded patent No. 8,546,935, “Semiconductor Packages,” to Micron Technology, Inc. of Boise, Idaho. According to background information provider by the inventors, the patent covers “semiconductor packages having grooves within a semiconductor die backside, and includes semiconductor packages utilizing carbon nanostructures (such as, for … [Read more...]
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