CoolIT’s OMNI ALC is a universal liquid cooling system for graphics cards. The OMNI’s water block is compatible with a wide range of video cards by simply swapping out a low-cost customized interposer plate. Alleviating the need to purchase an entirely new cooling solution for each new generation of video card, the system is a fully upgradeable, factory sealed, liquid cooled … [Read more...]
3D chip stacking to take Moore’s Law past 2020, pose new chip cooling challenges
A team of IBM Researchers in collaboration with two Swiss partners are looking to keep “Moore’s Law” alive for another 15 years. The law states that the number of transistors that can be placed inexpensively on an integrated circuit will double every 18 months. More than 50 years old, this law is still in effect, but to extend it as long as 2020 will require a change from mere … [Read more...]
IBM Work to take Moore’s Law to 2025
It was very interesting to read this article about the work IBM are undertaking together with École Polytechnique Fédérale de Lausanne (EPFL) and the Swiss Federal Institute of Technology Zurich (ETH) on a 3D stacked architecture for multiple cores. The four year collaborative project, called CMOSAIC, promises to deliver an interconnection density from 100 to 10,000 connections … [Read more...]
Liquid Cooling – Are We There Yet?
Back in June I posted ‘Air – Is it Running Out of Gas?’ and put forward the view that for general computing applications air isn’t running out of gas just yet. There are a couple of reasons for that. One is that I suspect the general public has concerns about leaks. Most people have passed cars stuck on the highway with a blown heater hose and seen water on the ground, and I’ve … [Read more...]
Back to the Future with a Liquid Cooled Supercomputer
Introduction: Evolution of Air and Water Cooling for Electronic Systems Since the development of the first electronic digital computers in the 1940s, efficient removal of heat has played a key role in insuring the reliable operation of successive generations of computers. In many instances the trend toward higher circuit packaging density to provide reductions in circuit delay … [Read more...]
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