Introduction As power densities of embedded electronics increase, cooling becomes a challenge especially in harsh environments. Liquid cooling is accepted as an attractive cooling method for an increasing number of applications. Direct spray is a particularly efficient form of liquid cooling that has recently been included on several manned and unmanned military platforms. This … [Read more...]
Using a Matrix Inverse Method to Solve a Thermal Resistance Network
Today virtually all serious thermal analysis and design calculations for electronic packages are performed using various commercial flow and thermal conduction codes. Nonetheless, there are still many instances, especially in the early phases of a project, when the thermal engineer finds it advantageous to perform so called "back of the envelope" calculations without resorting … [Read more...]
Cooling Electronics with Nanofluids: Laminar Convective Heat Transfer
Introduction Numerous reports over the past ten years or so have described the potential for nanofluids (suspensions of nanoparticles in liquids) to be applied as heat transfer fluids, because of the enhanced thermal conductivity and convective heat transfer characteristics that have generally been observed. A number of review articles have been published on nanofluids [1 � 8], … [Read more...]
Liquid Cooling for Datacom Equipment Centers
Introduction The increasing heat load densities in datacom equipment centers require ever more sophisticated approaches to cooling. Air-cooled systems are now struggling to provide the needed level of thermal performance for many installations and energy efficiency is an increasing concern. In fact, the standard implementation of air-cooled designs results in cooling energy … [Read more...]
Thermal Optimization And Design For Manufacturability Of Liquid-Air Hybrid Cooling Systems
Introduction Existing technologies typically utilize air to carry the heat away from a heat sink that is thermally coupled to the microprocessor. Higher performance devices such as workstations, "gaming" PCs, or tower servers that utilize components with greater power dissipation can require more aggressive cooling technology. A high-performance alternative to heat sinks is a … [Read more...]
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